Difference between pages "UniCDMA" and "Chip-Off BlackBerry Curve 9320"

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{{Wikify}}
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== Tear Down ==
  
==Features==
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<ol start="1">
===Modes===
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<li>Remove the back panel.</li>
*Hyndai HWT /HWP-110/120/220
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</ol>
*Hyndai HGC-310e, HGC-600e
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*LG
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*Qualcomm
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*Samsung SPH-A460
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*Samsung (general)
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*Samsung SCH-X127/X250/X350/…
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*Sky IM-1200/1400/2000/etc.
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*Withus
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===Read===
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{| border="1" cellpadding="2"
*Hardware date
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|-
*Software date
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| [[File:1-bb9320-BackPanelRemoved.jpg| 300px ]]
*Software version
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|-
*CAI rev
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|}
*SCM
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*ESN
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*Analog MIN
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*Digital MIN
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*Security Code
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*Lock Code
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*EEPROM
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**Size
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***custom or 16384, 32768, 65536
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**Memory
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***Starting Address
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***Length (bytes)
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****custom or 524288, 786432, 1310720, 1703936
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===Write===
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<ol start="2">
*ESN
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<li>Remove the SIM and SD Memory Card.</li>
*SCM
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</ol>
*A-KEY
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+
===Scan===
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*Memory
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**Range
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**Step (bytes)
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***custom or 256, 512, 1024, 2048, 4096, 8192, 16384, 32768, 65536, 131072, 262144, 524288, 1048576
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===Settings===
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<ol start="3">
*COM Port
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<li>Using a torx-6 screw driver remove the 2 visible screws on the back of the phone.</li>
**1 to 4
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</ol>
*Baud rate
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**19200, 38400, 57600, 115200
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 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:2-bb9320-ScrewRemoval.jpg| 300px ]]
 +
|-
 +
|}
  
==Forensics==
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<ol start="4">
UniCDMA can be used in small scale digital device forensics to modify ESN, modify firmware, unlock phones and access data.
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<li>Remove the screen protector using a shim, guitar pick, or prying tool.</li>
 +
</ol>
  
==Troubleshooting==
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{| border="1" cellpadding="2"
===LG===
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|-
If UniCDMA cannot be used to place an LG cell phone in DM Mode, the following procedures may be followed:
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| [[File:3-bb9320-ScreenRemoval.jpg| 300px ]]
*Close UniCDMA
+
|-
*Connect LG cell phone to computer using USB data cable
+
|}
*Open Hyperterminal
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*Connect to LG cellphone on correct COM port at 115200 bits per second
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<ol start="5">
*Place LG cellphone into DM mode by typing "AT$QCDMG"
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<li>Remove 2 torx-5 screws.</li>
*Close Hyperterminal
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</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:4-bb9320-ScrewRemoval.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="6">
 +
<li>Use the shim to detach the outer bezel/keyboard from the device.</li>
 +
</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:5-bb9320-TopPlate.jpg| 300px ]] 5-1-bb9320-TopPlate.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="7">
 +
<li>Remove 4 additional torx-6 screws. The main board will now easily be separated from the back plate</li>
 +
</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:6-bb9320-ScrewRemoval.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="8">
 +
<li>Peel off the vendor sticker.</li>
 +
</ol>
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:7-bb9320-VendorPlate.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="9">
 +
<li>Remove the plastic cover protecting the track pad ribbon cable, and disconnect the track pad.</li>
 +
</ol>
 +
 
 +
<ol start="10">
 +
<li>Remove the final torx-4 screw located beneath the plastic protector, to remove the plastic keyboard overlay.</li>
 +
</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:8-bb9320-ScrewRemoval.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="11">
 +
<li>Disconnect the ribbon cable connected to the LCD. Then using a pick separate the display from the main board.</li>
 +
</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:9-bb9320-ScreenRemoval.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="12">
 +
<li>The tear down is now complete</li>
 +
</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:9-1-bb9320-TearDownComplete.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
eMMC Removal
 +
 
 +
<ol start="1">
 +
<li>The eMMC is located beneath the heat shield directly above the Micro SD card slot.</li>
 +
</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:10-bb9320-EMMC-Location.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="2">
 +
<li>Place the main board in a stand or holder and position it approximately 2 1/2" - 3" inches away from a heat gun or device the blows super hot air.</li>
 +
</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:11-bb9320-HeatShield.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="3">
 +
<li>Monitoring the temperature the heat shield will come off easily between 190-200 Centigrade.</li>
 +
</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:12-bb9320-HeatShield.jpg| 300px ]] 13-bb9320-HeatShieldRemoved.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="4">
 +
<li>Continue working under the high heat. With the 9315/9320's I've worked on the eMMC has been ready to lift off of the main board using tweezers immediately after removing the heat shield.</li>
 +
</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:14-bb9320-EMMC-Removed.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="5">
 +
<li>Using liquid flux, or flux paste and a soldering iron clean the pads on the eMMC in preparation for a read</li>
 +
</ol>
 +
 
 +
{| border="1" cellpadding="2"
 +
|-
 +
| [[File:15-bb9320-EMMC-Cleanup.jpg| 300px ]]
 +
| [[File:16-bb9320-EMMC-Clean.jpg| 300px ]]
 +
|-
 +
|}
 +
 
 +
<ol start="6">
 +
<li>The eMMC is now ready to read using the appropriate adapter/programmer and software.</li>
 +
</ol>
 +
 
 +
At the time of this writing (2013OCT29) the eMMC that was removed in this example was read using an UP828 programmer via the "VBGA169E" adapter. The resulting image was then parsed via the CelleBrite Physical Analyzer (V. 3.8.5.108).

Revision as of 12:26, 30 October 2013

Tear Down

  1. Remove the back panel.
1-bb9320-BackPanelRemoved.jpg
  1. Remove the SIM and SD Memory Card.
  1. Using a torx-6 screw driver remove the 2 visible screws on the back of the phone.
2-bb9320-ScrewRemoval.jpg
  1. Remove the screen protector using a shim, guitar pick, or prying tool.
3-bb9320-ScreenRemoval.jpg
  1. Remove 2 torx-5 screws.
4-bb9320-ScrewRemoval.jpg
  1. Use the shim to detach the outer bezel/keyboard from the device.
5-bb9320-TopPlate.jpg 5-1-bb9320-TopPlate.jpg| 300px ]]
  1. Remove 4 additional torx-6 screws. The main board will now easily be separated from the back plate
6-bb9320-ScrewRemoval.jpg
  1. Peel off the vendor sticker.
7-bb9320-VendorPlate.jpg
  1. Remove the plastic cover protecting the track pad ribbon cable, and disconnect the track pad.
  1. Remove the final torx-4 screw located beneath the plastic protector, to remove the plastic keyboard overlay.
8-bb9320-ScrewRemoval.jpg
  1. Disconnect the ribbon cable connected to the LCD. Then using a pick separate the display from the main board.
9-bb9320-ScreenRemoval.jpg
  1. The tear down is now complete
9-1-bb9320-TearDownComplete.jpg

eMMC Removal

  1. The eMMC is located beneath the heat shield directly above the Micro SD card slot.
10-bb9320-EMMC-Location.jpg
  1. Place the main board in a stand or holder and position it approximately 2 1/2" - 3" inches away from a heat gun or device the blows super hot air.
11-bb9320-HeatShield.jpg
  1. Monitoring the temperature the heat shield will come off easily between 190-200 Centigrade.
12-bb9320-HeatShield.jpg 13-bb9320-HeatShieldRemoved.jpg| 300px ]]
  1. Continue working under the high heat. With the 9315/9320's I've worked on the eMMC has been ready to lift off of the main board using tweezers immediately after removing the heat shield.
14-bb9320-EMMC-Removed.jpg
  1. Using liquid flux, or flux paste and a soldering iron clean the pads on the eMMC in preparation for a read
15-bb9320-EMMC-Cleanup.jpg 16-bb9320-EMMC-Clean.jpg
  1. The eMMC is now ready to read using the appropriate adapter/programmer and software.

At the time of this writing (2013OCT29) the eMMC that was removed in this example was read using an UP828 programmer via the "VBGA169E" adapter. The resulting image was then parsed via the CelleBrite Physical Analyzer (V. 3.8.5.108).